PHOTO-LITHOGRAPHY & DICING:
Resist patterns for subsequent fabrication can be created on substrates with 15 micron resolution. Ceramic substrates and Si wafers can be diced as required (with +/- one mil tolerance).

REACTIVE ION ETCHING:
Thin metal and polymer coatings can be etched in CF4/O2 plasmas.

ION MILLING:
Using appropriate resist masks, the thin film stacks can be ion milled as specified in customer requirements..

WET ETCHING:
Standard coatings can be wet etched as required for circuit fabrication.

We invite your inquiries for your coating and/or circuit fabrication requirements whether they are for research development or production. For a rapid response to your needs please contact us.