Sputtered Coatings:

With over ten sputter systems set up, we are able to dedicate specific machines to commonly used coatings, providing consistency and quick production.

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• Conductive coating: These are metal coatings applied to various substrates (e.g. Alumina, BeO, AIN, Quartz, Silicon wafers, PZT etc). They consist of an adhesive layer, a barrier layer (sometimes omitted) and a conductive layer which can be used for wire bonding or soldering applications. Our most common coatings (some sputtered on a daily basis) are: TiW-Ni-Au, Ti-NiV-Au, Ti-Pt-Au, Cr-Ni-Au and TiW-Ni-Ag
  
  
• Resistive coatings: For values from 10 to 150 ohms per square, we supply TaN and NiCr coatings that are stabilized and have low TRC values. In the 500 ohms/sq. range we supply SiCr and SiCrOx. In the 1 mega-ohm plus range we supply doped poly Si.
  
  
• Di-electric coatings: Our most common di-electric coatings are Al203. SiO2,, and Si3N4. We have developed processes to ensure that they have the right index and are dense. We can also sputter Ta2O5, ZrO2, Y2O3, MoO2, WO2, PtO2 and others.
  
  
• Transparent Conductive coatings: We have developed processes for ITO on glass, Si and Polymer substrates, with low Rs and high transmission values. We also provide SnO2, ZnO and thin Au and Ag films as transparent conductive coatings.
  
  
• Coatings for heat sinks: We provide sputtered AuSn, In and Sn, which can have an overlay of other coatings.
  
  
• Other coatings: Processes have been developed for Al and Al alloys, TiN, BN, Co, Mo, Nb, Co, Si, SiC, TiB2, Zn, Zr, C, Ru and others. We can sputter any materials available as long as they are not toxic.
  
  
  
  

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  Evaporated Coatings:
  

• Optical coatings: Examples AR and HR for lasers and windows. AR coatings may be combined with Ti-Ni-Au on the circumference of windows for soldering to metal frames.
  
  
• Metal: Examples Ti-Pt-Au for lift off applications.
  
  
• Other material: Examples Al, Al2O3, Co, Cr, Ge, HfO2, La2O3, MgF2, Nb2O5, Ni, SiO, SiO2, Ta2O5, Ti, TiO2, W, ZnS, ZrF, ZrO2.
  
  
  Circuit Fabrication (Photo-lithography, ion milling, RIE, wet etching):
  

• Selected jobs are accepted since we are limited to 12 micron geometries and our capacity is not as large.