Over the last 20 years, PVD (physical vapor deposition) processes have been developed to deposit various coatings particularly by sputtering. Prior to deposition of the coating, the substrate may be cleaned by wet processes followed by DI water rinse and vapor dry. Additionally, dry processes such as plasma ashing, high temperature firing, ozone cleaning, and argon or reactive gas sputter etching can also be utilized. Thin film circuit fabrication and thin film component manufacturing are a growing area of our business. Both wet and dry (Ion Milling/RIE) techniques are employed.
Components are manufactured to your designs utilizing either Au or Cu based conductors and TaN or NiCr resistors if required. Circuits with through hole vias, front and back metallizations can be accommodated. Standard substrate materials are polished or as fired 99.6% Alumina, polished or lapped AlN, Diamond, and Quartz.
Please forward your drawings to our engineering staff for quotations or help with designs.
Call with any questions or for specials